Uv curing type silicone pressure sensitive adhesive composition

In recent years, for smart phones, liquid crystal displays, vehicle components as the representative of the electronic equipment, not only requires high performance, but also requires space saving, energy saving. In this society, electrical and electronic components are becoming smaller and smaller, and the assembly process is becoming more complicated and difficult. In recent years, technologies that can selectively and collectively transfer such micro-refined components and components have been developed.

Transferring the technology, called Micro Printing (Micro-Transfer-Printing) technology, is the use of adhesion of disposable picking up subtle parts of the elastomer, causing them to Transfer the adhesion strength of the desired place.

As the pressure-sensitive bonding material used in this purpose, organosilicon elastomers are known, and a large number of heating and curing types of solvent-free organosilicon system pressure-sensitive adhesives have been proposed. However, in the case of the heating and curing type of silicone pressure-sensitive adhesive, energy is required due to the heating process, in addition, the heating and cooling of the material takes a lot of time. In order to eliminate such a process, the development of organosilicone resin which can be cured in a short time by using ultraviolet light has been carried out. However, due to the adhesive strength of organosilicon raw material itself, there are some problems such as insufficient cohesive force and limited components and components that can be used.

Therefore, in terms of materials, it is desirable to have UV-curable pressure-sensitive bonded silicone materials that can also be applied to components and components that are not lifted and have stronger adhesion. However, if the adhesion is simply increased, it is easy to incur cohesive failure when the pressure-sensitive adhesive is removed from the transfer, and there is a problem of the pressure-sensitive adhesive remaining in the transferred components and components. Therefore, there is a strong desire to develop materials that can be cured by ultraviolet light, that can be adjusted from weak adhesion to strong adhesion according to the member, and that, although they have strong adhesion, do not cohesively break when stripped.