Cut crystalline mucocrystalline monolithic film and the pressure sensitive adhesive film used

Semiconductor devices are manufactured by the following processes. First, the crystal cutting process was implemented in the state of wafer attached with pressure-sensitive adhesive film for crystal cutting. Then, mounting, pickup, mounting, diebonding, and so on. In the manufacturing process of a semiconductor device, a film called a cut-crystal mucous monolayer is used.

The film has a structure consisting, in turn, of a substrate layer, a pressure-sensitive adhesive layer, and an adhesive layer, for example, as used in the following. First, the wafer is attached to the surface of the adhesive layer side and the wafer is cut while the wafer is fixed by dicingring.

Thus, the wafer is monolithic into a large number of chips (chips). Then, after the adhesive force relative to the pressure sensitive adhesive layer was reduced by irradiating ultraviolet light on the pressure sensitive adhesive layer, the adhesive sheet formed from the chip together with the adhesive layer was picked up from the pressure sensitive adhesive layer. After that, a semiconductor device is made by installing the chip on the substrate through a adhesive sheet.

In addition, the layer containing the chip obtained through the crystal cutting process and the adhesive sheet attached to the chip is called the grain adhesion film (DAF).

As mentioned above, the pressure sensitive adhesive layer (crystal cutting film) which is weakened by ultraviolet radiation is called ultraviolet (UV) curing type. In contrast, in the manufacturing process of semiconductor devices, the pressure sensitive adhesive layer is not exposed to ultraviolet light and the adhesive relay remains constant, which is called pressure sensitive.

However, the film used in the manufacturing process of semiconductor devices requires antistatic property. A sheet for semiconductor processing has a pressure sensitive adhesive layer solidified by irradiating an energy line.

The pressure sensitive adhesive composition comprises a polymer having quaternary ammonium salt (antistatic agent) and an energy line curable basis, and an energy line curable pressure sensitive adhesive component (except the polymer). According to the semiconductor processing sheet, it can play excellent antistatic property and can inhibit the contamination of adhesive (wafer or chip) during stripping.